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WPL Board Size 560mm x 640mm |
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Finish Thickness 0.3~3.5mm |
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PCB Layer Count 2~16 Layers |
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Finish Copper HOZ~6OZ |
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Aspect Ratio 10:1 |
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Impedance Requirement 90~100¡Ó10% |
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the Tolerance of Board Thickness ¡Ó10% |
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Min Finish Hole 0.15mm ¡BLaser 0.075mm |
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Hole Position Alignment Extent ¡Ó2mil |
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Min Trace / Gap of inner layer/ Gap of inner layer 3/3mil |
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Min Trace / Gap of outer layer 3/3mil |
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Min Ring size 4mil |
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Min. S/M Opening ( One Sided ) 2mil |
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Min Solder Bridge Design 2mil |
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Plug Hole Size ¡Ø0.7mm |
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Thickness of Gold Plating 2 ~ 40£g" |
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the thickness of immersion Gold 2~8u" |
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Width/Height of Silkscreen 5mil/25mil |
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the Tolerance of CNC/PUNCH ¡Ó0.1mm |
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O/S Test Conditon 50-300V¡B1M£[-100M£[ |
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CAM Operation System Orbotech Genesis¡BCAM350 |
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surface finish ENIG Immersion Silver Immersion TinHASL OSP, Gold Finger etc |
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Base Material CEM-3¡BFR-4¡BHF¡BHigh Tg¡BAl laminate¡Bcopper laminate¡BTeflon,etc |